1. general description 1.1 addendum this document gives specifications for the product mf0 moa4 u10. the mf0 moa4 u10 is the integrated circuit mf0 ic u10 in the package sot500ba2. therefore this document encompasses all info rmation not covered by the specification of the package and/or the functional spec ification of the integrated circuit. detailed information on the package is given in the moa4 contactless chip card module specification. functionality of the integrated circuit is described in the mf0 ic u10 functional specification. 2. features 3. applications 4. ordering information 5. functional description 5.1 chip functionality of the integrated circuit is desc ribed in the document mf0 ic u10 functional specification. mf0 moa4 u10 mifare ultralight contact less chip card module rev. 3.1 ? 7 february 2007 product data sheet 120931 public table 1. ordering information type number package name description ordering code mf0 moa4 u10 / d 12 nc: 9352 817 85118
120931 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 3.1 ? 7 february 2007 2 of 5 nxp semiconductors mf0 moa4 u10 mifare ultralight contactless chip card module 6. limiting values [1] stresses above one or more of the limiting values may cause permanent damage to the device [2] these are stress ratings only. operation of the device at these or any other conditions above those given in the characteristics section of t he specification is not implied [3] exposure to limiting values for ext ended periods may affect device reliability [4] for processing temperature: refer to ?moa 4 contactless chip card module specification? [5] mil standard 883-c method 3015; human body model: c = 100 pf, r = 1.5 k 7. characteristics 7.1 electrical characteristics at ? 25 c < t ambient < + 70 c [1] stresses above one or more of the limiting values may cause permanent damage to the device [2] these are stress ratings only. operation of the device at these or any other conditions above those given in the characteristics section of t he specification is not implied [3] exposure to limiting values for ext ended periods may affect device reliability [4] rms between l a and l b 8. support information for additional information, please visit: http://www.nxp.com table 2. limiting values [1] [2] [3] [4] in accordance with the absolute maximum rating system(iec 134) symbol parameter conditions min max unit t stor storage temperature [4] -25 85 c t op operating temperature -25 70 c v esd esd voltage level mil883d, human body [5] 2- kv peak table 3. characteristics [1] [2] [3] symbol parameter conditions min type max unit c in input capacitance input voltage 3 v rms 25c [4] 14.85 17 20.13 pf f in input frequency - 13.56 - mhz t w eeprom write time - 3.8 - ms n we eeprom write endurance 10000 - - cycles t ret eeprom data retention t amb 55 c 5 - - years
120931 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 3.1 ? 7 february 2007 3 of 5 nxp semiconductors mf0 moa4 u10 mifare ultralight contactless chip card module 9. revision history table 4. revision history document id release date data sheet status change notice supersedes 120930 january 2006 product data sheet 3.0 120931 7 february 2007 product data sheet 3.1 modifications: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate.
120931 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 3.1 ? 7 february 2007 4 of 5 nxp semiconductors mf0 moa4 u10 mifare ultralight contactless chip card module 10. legal information 10.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 10.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors d oes not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equi pment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and condit ions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writ ing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. 10.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. mifare ? is a trademark of nxp b.v. 11. contact information for additional information, please visit: http://www.nxp.com for sales office addresses, send an email to: salesaddresses@nxp.com document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
nxp semiconductors mf0 moa4 u10 mifare ultralight contactless chip card module ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 7 february 2007 document identifier: 120931 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 12. tables table 1. ordering information . . . . . . . . . . . . . . . . . . . . .1 table 2. limiting values [1][2][3][4] . . . . . . . . . . . . . . . . . . . .2 table 3. characteristics [1][2][3] . . . . . . . . . . . . . . . . . . . . . 2 table 4. revision history . . . . . . . . . . . . . . . . . . . . . . . . . 3 13. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 addendum . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 functional description . . . . . . . . . . . . . . . . . . . 1 5.1 chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.1 electrical characteristics . . . . . . . . . . . . . . . . . 2 8 support information . . . . . . . . . . . . . . . . . . . . . 2 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 3 10 legal information. . . . . . . . . . . . . . . . . . . . . . . . 4 10.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 4 10.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 10.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 10.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 11 contact information. . . . . . . . . . . . . . . . . . . . . . 4 12 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 13 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
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